Henkel Silver Filled Epoxy

Electrically conductive silver filled epoxy films when used to attach substrates also serve as ground planes and provide rf emi shielding.

Henkel silver filled epoxy.

They are also used in the high production automated attachment of leadframes to chips and to bond chips vertically in chip stacks. Excellent peel and shear strength. Henkel loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals ceramics rubbers and plastics as used in electronic parts where good adhesion combined with electrical and thermal conductivity is required. Our unrivaled portfolio of adhesives sealants and functional coatings are designed to transform markets and the way you work.

Henkel loctite 402 adhesive silver is a two component room temperature curing epoxy paste that is used for sealing and bonding electronic components heat sensitive materials plastic laminates metals and ceramics. We enable the transformation of entire industries giving our customers a competitive advantage and offering consumers a unique experience. Henkel adhesive technologies is leading today s markets and shaping tomorrow s through its adhesives sealants and functional coatings. Low linear shrinkage upon cure.

Cures at room temperature. As well as silver filled epoxies recommended for electronic bonding and sealing applications that comply with the requirements of nasa. Innovative thinking and entrepreneurial spirit are part of our dna. At henkel innovative thinking and entrepreneurial spirit are in our dna.

We are curious and passionate experts with deep market and application knowledge. Serviceable from 4k to 250 f. Resists vibration impact thermal cycling. Henkel s two component electrically conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range.

We re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable. Technology epoxy film appearance silver cure heat cure product benefits thin uniform bondline provides rf emi shielding electrically conductive in x y z axes excellent electrical and thermal conductivity application die attach thickness 2 to 6 mils filler type silver typical package application microwave circuitry and heat. Silver filled electrically conductive epoxy adhesive. It is silver filled electrically conductive thermally conductive and solventless.